IC Packaging Update 1999

This book, as a supplement to Roadmaps of Packaging Technology, available from ICE, provides an update on the latest packaging and interconnect choices which are arising from the revolutionary changes, rocking the industry. In addition to the “what and the how”, this book offers the “why”, a perspective and analysis that will facilitate the decision making process so that packaging technology consumers can be informed consumers.It is a map of the trails through the packaging and interconnect forest.