Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling

Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling image
ISBN-10:

1489987975

ISBN-13:

9781489987976

Author(s): Liu, Yong
Edition: 2012
Released: Apr 13, 2014
Publisher: Springer
Format: Paperback, 612 pages
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Description:

This in-depth view of varied aspects of power electronic packaging systematically introduces design, assembly, reliability and failure analysis and materials selection, as well as covering the most advanced simulation and modeling techniques in the field.

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