Chip Scale Package: Design, Materials, Process, Reliability, and Applications

Chip Scale Package: Design, Materials, Process, Reliability, and Applications image
ISBN-10:

0070383049

ISBN-13:

9780070383043

Edition: 1
Released: Feb 28, 1999
Format: Hardcover, 564 pages
to view more data

Description:

The first comprehensive, in-depth guide to chip scale packaging, this reference gives you cutting-edge information on the most important new development in electronic packaging since surface mount technology (SMT). Featuring the latest design techniques, plus details on more than 40 different types of CSP, Chip Scale Package hands engineers and designers the complete, professional set of working tools that they need to solve technical and design issues; find the most efficient, cost-effective CSP solutions for their deployments; answer questions on interfacing, speed, robustness, and more; compare properties of wirebonds, flip chips, rigid and flex substrates, wafer-level redistribution, and other CSP products; get the latest information on new offerings from Fujitsu, GE, Hitachi, IBM, Matushita, Motorola, National Semiconductor, NEC, Sharp, Sony, Toshiba, Amkor, TT, LG Semicon, Mitsubishi, Shell Case, Tessera, Samsung, and other major companies; and learn about CSP products under development. A revolution in electronics, CSP is taking the electronics industry by storm. Page after page, this standard-setting guide gives you both essential technical details and an eye-opening overview of this fast-developing field. No matter how you use Chip Scale Package, youÕll see why itÕs the resource of choice for those who want to be at the top of the game.


























We're an Amazon Associate. We earn from qualifying purchases at Amazon and all stores listed here.

Want a Better Price Offer?

Set a price alert and get notified when the book starts selling at your price.

Want to Report a Pricing Issue?

Let us know about the pricing issue you've noticed so that we can fix it.