Chip Scale Package: Design, Materials, Process, Reliability, and Applications
Description:
The first comprehensive, in-depth guide to chip scale packaging, this reference gives you cutting-edge information on the most important new development in electronic packaging since surface mount technology (SMT). Featuring the latest design techniques, plus details on more than 40 different types of CSP, Chip Scale Package hands engineers and designers the complete, professional set of working tools that they need to solve technical and design issues; find the most efficient, cost-effective CSP solutions for their deployments; answer questions on interfacing, speed, robustness, and more; compare properties of wirebonds, flip chips, rigid and flex substrates, wafer-level redistribution, and other CSP products; get the latest information on new offerings from Fujitsu, GE, Hitachi, IBM, Matushita, Motorola, National Semiconductor, NEC, Sharp, Sony, Toshiba, Amkor, TT, LG Semicon, Mitsubishi, Shell Case, Tessera, Samsung, and other major companies; and learn about CSP products under development. A revolution in electronics, CSP is taking the electronics industry by storm. Page after page, this standard-setting guide gives you both essential technical details and an eye-opening overview of this fast-developing field. No matter how you use Chip Scale Package, youÕll see why itÕs the resource of choice for those who want to be at the top of the game.
Best prices to buy, sell, or rent ISBN 9780070383043
Frequently Asked Questions about Chip Scale Package: Design, Materials, Process, Reliability, and Applications
The price for the book starts from $42.76 on Amazon and is available from 3 sellers at the moment.
If you’re interested in selling back the Chip Scale Package: Design, Materials, Process, Reliability, and Applications book, you can always look up BookScouter for the best deal. BookScouter checks 30+ buyback vendors with a single search and gives you actual information on buyback pricing instantly.
As for the Chip Scale Package: Design, Materials, Process, Reliability, and Applications book, the best buyback offer comes from and is $ for the book in good condition.
The Chip Scale Package: Design, Materials, Process, Reliability, and Applications book is in very low demand now as the rank for the book is 5,447,306 at the moment. A rank of 1,000,000 means the last copy sold approximately a month ago.
The highest price to sell back the Chip Scale Package: Design, Materials, Process, Reliability, and Applications book within the last three months was on November 14 and it was $2.45.