Shock and Vibration Handbook (Electronic Packaging and Interconnection Series)

Chapters are grouped according to subject matter. The first group discusses theory; the second considers instrumentation and measurements, and procedures for analyzing and testing systems subjected to shock and vibration. Vibration that is induced by ground motion and fluid flow is considered next; then methods of controlling shock and vibration; followed by chapters on packaging engineering to prevent equipment from being damaged in transit; on the theory and practice of equipment design; and on the effects of shock and vibration on humans. New material includes computer techniques for solving problems, new instrumentation based on microchip technology, advances in analysis of data and models, application of finite element methods, and test criteria and specifications.