Flexible Distribution Networks

Engineering & Transportation

Li, Peng

Yu, Hao

Wang, Chengshan

Ji, Haoran

Engineering

Elsevier

Arkansas' Tobacco Settlement Proceeds Act invests the state's share of the tobacco Master Settlement Agreement funds in seven health-related programs. This report assesses the progress of each of the funded programs in achieving its long-range goals, tracks the programs' process indicators, and updates trends in outcome measures developed to monitor effects of the funded programs on smoking and other health-related outcomes.

Evaluation of the Arkansas Tobacco Settlement Program: Progress During 2006 and 2007

Business & Money

Schultz, Dana

Tharp-Taylor, Shannah

Dubowitz, Tamara

Lovejoy, Susan

Business Culture

RAND Corporation

Arkansas' Tobacco Settlement Proceeds Act invests the state's share of the tobacco Master Settlement Agreement funds in seven health-related programs. This report evaluates the activities and progress of each of the funded programs in achieving its goals and updates trends in outcome measures developed to monitor effects of the funded programs on smoking and other health-related outcome.

Evaluation of the Arkansas Tobacco Settlement Program: Progress During 2008 and 2009 (Technical Report)

Lovejoy, Susan L.

This book presents the latest techniques for characterization, modeling and design for nano-scale non-volatile memory (NVM) devices. Coverage focuses on fundamental NVM device fabrication and characterization, internal state identification of memristic dynamics with physics modeling, NVM circuit design and hybrid NVM memory system design-space optimization. The authors discuss design methodologies for nano-scale NVM devices from a circuits/systems perspective, including the general foundations for the fundamental memristic dynamics in NVM devices. Coverage includes physical modeling, as well as the development of a platform to explore novel hybrid CMOS and NVM circuit and system design.
• Offers readers a systematic and comprehensive treatment of emerging nano-scale non-volatile memory (NVM) devices; • Focuses on the internal state of NVM memristic dynamics, novel NVM readout and memory cell circuit design and hybrid NVM memory system optimization; • Provides both theoretical analysis and practical examples to illustrate design methodologies; • Illustrates design and analysis for recent developments in spin-toque-transfer, domain-wall racetrack and memristors.

Design Exploration of Emerging Nano-scale Non-volatile Memory

Science & Math

Wang, Yuhao

Physics

Springer

Exa-scale computing needs to re-examine the existing hardware platform that can support intensive data-oriented computing. Since the main bottleneck is from memory, we aim to develop an energy-efficient in-memory computing platform in this book. First, the models of spin-transfer torque magnetic tunnel junction and racetrack memory are presented. Next, we show that the spintronics could be a candidate for future data-oriented computing for storage, logic, and interconnect. As a result, by utilizing spintronics, in-memory-based computing has been applied for data encryption and machine learning. The implementations of in-memory AES, Simon cipher, as well as interconnect are explained in details. In addition, in-memory-based machine learning and face recognition are also illustrated in this book.

Non-Volatile In-Memory Computing by Spintronics (Synthesis Lectures on Emerging Engineering Technologies)

Computers & Technology

Ni, Leibin

Computer Science

Morgan & Claypool Publishers

The transition towards exascale computing has resulted in major transformations in computing paradigms. The need to analyze and respond to such large amounts of data sets has led to the adoption of machine learning (ML) and deep learning (DL) methods in a wide range of applications. One of the major challenges is the fetching of data from computing memory and writing it back without experiencing a memory-wall bottleneck. To address such concerns, in-memory computing (IMC) and supporting frameworks have been introduced. In-memory computing methods have ultra-low power and high-density embedded storage. Resistive Random-Access Memory (ReRAM) technology seems the most promising IMC solution due to its minimized leakage power, reduced power consumption and smaller hardware footprint, as well as its compatibility with CMOS technology, which is widely used in industry. In this book, the authors introduce ReRAM techniques for performing distributed computing using IMC accelerators, present ReRAM-based IMC architectures that can perform computations of ML and data-intensive applications, as well as strategies to map ML designs onto hardware accelerators. The book serves as a bridge between researchers in the computing domain (algorithm designers for ML and DL) and computing hardware designers.

ReRAM-based Machine Learning (Computing and Networks)

Pudukotai Dinakarrao, Sai Manoj

The Institution of Engineering and Technology

Exa-scale computing needs to re-examine the existing hardware platform that can support intensive data-oriented computing. Since the main bottleneck is from memory, we aim to develop an energy-efficient in-memory computing platform in this book. First, the models of spin-transfer torque magnetic tunnel junction and racetrack memory are presented. Next, we show that the spintronics could be a candidate for future data-oriented computing for storage, logic, and interconnect. As a result, by utilizing spintronics, in-memory-based computing has been applied for data encryption and machine learning. The implementations of in-memory AES, Simon cipher, as well as interconnect are explained in details. In addition, in-memory-based machine learning and face recognition are also illustrated in this book.

This book presents the latest techniques for machine learning based data analytics on IoT edge devices. A comprehensive literature review on neural network compression and machine learning accelerator is presented from both algorithm level optimization and hardware architecture optimization. Coverage focuses on shallow and deep neural network with real applications on smart buildings. The authors also discuss hardware architecture design with coverage focusing on both CMOS based computing systems and the new emerging Resistive Random-Access Memory (RRAM) based systems. Detailed case studies such as indoor positioning, energy management and intrusion detection are also presented for smart buildings.

Compact and Fast Machine Learning Accelerator for IoT Devices (Computer Architecture and Design Methodologies)

Huang, Hantao

Games & Strategy Guides

3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.
Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.
Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.

ADVANCES IN 3D INTEGRATED CIRCUITS AND SYSTEMS (Series on Emerging Technologies in Circuits and Systems, 1)

Tan, Chuan Seng

World Scientific Pub Co Inc

3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs. Contents presented in this book include fabrication techniques for 3D Tsv and 2.5D Tsi; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory. Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.

Advances In 3D Integrated Circuits And Systems (Emerging Technologies in Circuits and Systems)

WSPC

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