3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.
Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.
Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.

ADVANCES IN 3D INTEGRATED CIRCUITS AND SYSTEMS (Series on Emerging Technologies in Circuits and Systems, 1)

Engineering & Transportation

Yu, Hao

Tan, Chuan Seng

Engineering

World Scientific Pub Co Inc

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Books by Tan, Chuan Seng

See the best price to sell, buy, or rent books by Tan, Chuan Seng. BookScouter helps to compare book prices from 25+ online bookstores and 30+ buyback vendors with a single search.

ADVANCES IN 3D INTEGRATED CIRCUITS AND SYSTEMS (Series on Emerging Technologies in Circuits and Systems, 1)