The 52nd Colloid and Surface Science Symposium of the Divis ion of Colloid and Surface Chemistry of the American Chemical Society was held in Knoxville, TN, June 12-14, 1978, and one of its Sections was devoted to the topic of Solution Chemistry of Surfactants. Although it was billed as the Section on Solution Chemistry of Surfactants, but it was indeed a veritable inter national symposium on this topic as 51 papers by about 100 con tributors from 12 countries were listed in the program. The present volume and its companion volume 2 document the proceedings of the above-mentioned Section on Solution Chemistry of Surfactants. In 1976 there was held an international symposium on Micellization, Solubilization and Microemulsions in Albany, l the proceedings of which have been chronicled in two volumes. A great deal of material dealing with micelles contributed by a legion of prominent researchers constitutes these volumes but a few subtopics were not adequately covered; so it was deemed appro priate to cover these topics as well as the recent progress in the general area of aggregation of surfactants in this Section. Also as it is the amphiphilicity or amphipathicity* of a surfact ant molecule which is responsible for both adsorption at inter faces and aggregation in solution, so it was considered quite apropos to include the topic of adsorption at interfaces in this Section. Concomitantly, the present volumes not only cover the aggregation phenomena but also the adsorption at interfaces.

Solution Chemistry of Surfactants: Volume 1

Health, Fitness & Dieting

Mittal, K. L.

Psychology & Counseling

Plenum Press

This volume documents the proceedings of the International Symposium on Adhesive Joints: Formation, Characteristics and Testing held under the auspices of the Division of Polymer Mater ials:Science and Engineering of the American Chemical Society in Kansas City, MO, September 12-17, 1982. There is a myriad of applications (ranging from aerospace to surgery) where adhesives are used to join different materials, and concomitantly the understanding of the behavior of adhesive joints becomes very important. There are many factors which can influence the behavior of adhesive joints, e.g., substrate preparation, in terfacial aspects, joint design, mode of stress, external environ ment, etc., and in order to understand the joint behavior in a holistic manner, one must take due cognizance of all these germane factors. So this symposium was planned to address not only how to make acceptable bonds but their characterization, durability and testing were also accorded due consideration.

Adhesive Joints: Formation, Characteristics, and Testing

Science & Math

Chemistry

Springer

This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; <ul>
<li>Various theories or mechanisms of adhesion</li> <li>Surface (physical or chemical) characterization of materials as it pertains to adhesion</li> <li>Surface cleaning as it pertains to adhesion</li> <li>Ways to improve adhesion</li> <li>Unraveling of interfacial interactions using an array of pertinent techniques</li> <li>Characterization of interfaces / interphases</li> <li>Polymer-polymer adhesion</li> <li>Metal-polymer adhesion (metallized polymers)</li> <li>Polymer adhesion to various substrates</li> <li>Adhesion of thin films</li> <li>Adhesion of underfills</li> <li>Adhesion of molding compounds</li> <li>Adhesion of different dielectric materials</li> <li>Delamination and reliability issues in packaged devices</li> <li>Interface mechanics and crack propagation</li> <li>Adhesion measurement of thin films and coatings</li> </ul>

Adhesion in Microelectronics (Adhesion and Adhesives: Fundamental and Applied Aspects)

Engineering & Transportation

Ahsan, Tanweer

Engineering

Wiley-Scrivener

The book provides a comprehensive and easily accessible reference source covering all important aspects of particle adhesion and removal. The core objective is to cover both fundamental and applied aspects of particle adhesion and removal with emphasis on recent developments. Among the topics to be covered include: 1. Fundamentals of surface forces in particle adhesion and removal. 2. Mechanisms of particle adhesion and removal. 3. Experimental methods (e.g. AFM, SFA,SFM,IFM, etc.) to understand particle-particle and particle-substrate interactions. 4. Mechanics of adhesion of micro- and nanoscale particles. 5. Various factors affecting particle adhesion to a variety of substrates. 6. Surface modification techniques to modulate particle adhesion. 7. Various cleaning methods (both wet &amp; dry) for particle removal. 8. Relevance of particle adhesion in a host of technologies ranging from simple to ultra-sophisticated.

Particle Adhesion and Removal (Adhesion and Adhesives: Fundamental and Applied Aspects)

Jaiswal, Ravi

Physics

The book provides a unique overview on laser techniques and applications for the purpose of improving adhesion by altering surface chemistry and topography/morphology of the substrate. It details laser surface modification techniques for a wide range of industrially relevant materials (plastics, metals, ceramics, composites) with the aim to improve and enhance their adhesion to other materials. The joining of different materials is of critical importance in the fabrication of many and varied products.

Laser Surface Modification and Adhesion (Adhesion and Adhesives: Fundamental and Applied Aspects)

Bahners, Thomas

This is the third Volume in the series “Advances in Contact Angle, Wettability and Adhesion” initiated to consolidate information and provide commentary on certain recent research aspects dealing with this important topic. Its predecessor Volumes 1 and 2 were published in 2013 and 2015, respectively. This new book comprising 15 research and review articles is divided into four parts: Part 1: Contact Angle Measurement and Analysis; Part 2: Wettability Behavior; Part 3: Hydrophobic/Superhydrophobic Surfaces; Part 4: Wettability, Surface Free Energy and Adhesion. The topics covered include: O Procedure to measure and analyse contact angles/drop shape behaviors. O Contact angle measurement considering spreading, evaporation and reactive substrate. O Measurement of contact angle of a liquid on a substrate of the same liquid. O Evolution of the axisymmetric droplet shape parameters. O Interfacial modulus of a solid surface. O Functionalization of textiles using UV-based techniques for surface modification―patterned wetting behavior. O Wettability behavior of oleophilic and oleophobic nanorough surfaces. O Wettability behavior of nanofluids. O Dielectrowetting for digital microfluidics. O Hydrophobicity and superhydrophobicity in fouling prevention. O Superhydrophobic/superhydrophilic hybrid surface. O Laser material processing for enhancing stem cell growth. O Wettability correlation for bioadhesion to different materials. O Determination of the surface free energy of solid surfaces: statistical consideration. O Determination of apparent surface free energy using hysteresis approach.

Advances in Contact Angle, Wettability and Adhesion, Volume 3

This timely book on structural adhesives joints showcases all the pertinent topics and will be of immense value to scientists and engineers in many industries. Most structures are comprised of a number of individual parts or components which have to be connected to form a system with integral load transmission path. The structural adhesive bonding represents one of the most enabling technologies to fabricate most complex structural configurations involving advanced materials (e.g. composites) for load-bearing applications. Quite recently there has been a lot of activity in harnessing nanotechnology (use of nanomaterials) in ameliorating the existing or devising better performing structural adhesives. The 10 chapters by subject matter experts look at the following issues: <ul> <li>Surface preparation for structural adhesive joints (SAJ)</li> <li>Use of nanoparticles in enhancing performance of SAJ</li> <li>Optimization of SAJ</li> <li>Durability aspects of SAJ</li> <li>Debonding of SAJ</li> <li>Fracture mechanics of SAJ</li> <li>Failure analysis of SAJ</li> <li>Damage behavior in functionally graded SAJ</li> <li>Impact, shock and vibration characteristics of composites for SAJ</li> <li>Delamination arrest methods in SAJ</li> </ul>

Structural Adhesive Joints (Adhesion and Adhesives: Fundamental and Applied Aspects)

This volume documents the proceedings of the International Symposium on Adhesive Joints: Formation, Characteristics and Testing held under the auspices of the Division of Polymer Mater­ ials:Science and Engineering of the American Chemical Society in Kansas City, MO, September 12-17, 1982. There is a myriad of applications (ranging from aerospace to surgery) where adhesives are used to join different materials, and concomitantly the understanding of the behavior of adhesive joints becomes very important. There are many factors which can influence the behavior of adhesive joints, e.g., substrate preparation, in­ terfacial aspects, joint design, mode of stress, external environ­ ment, etc., and in order to understand the joint behavior in a holistic manner, one must take due cognizance of all these germane factors. So this symposium was planned to address not only how to make acceptable bonds but their characterization, durability and testing were also accorded due consideration.

Crafts, Hobbies & Home

Gardening & Landscape Design

Polyimides: Fundamentals and Applications (Plastics Engineering)

Ghosh, Malay

CRC-Press

See the best price to sell, buy, or rent books by Mittal, K. L.. BookScouter helps to compare book prices from 25+ online bookstores and 30+ buyback vendors with a single search.

Books by Mittal, K. L.

See the best price to sell, buy, or rent books by Mittal, K. L.. BookScouter helps to compare book prices from 25+ online bookstores and 30+ buyback vendors with a single search.

Solution Chemistry of Surfactants: Volume 1

Adhesive Joints: Formation, Characteristics, and Testing

Adhesion in Microelectronics (Adhesion and Adhesives: Fundamental and Applied Aspects)

Particle Adhesion and Removal (Adhesion and Adhesives: Fundamental and Applied Aspects)

Laser Surface Modification and Adhesion (Adhesion and Adhesives: Fundamental and Applied Aspects)

Advances in Contact Angle, Wettability and Adhesion, Volume 3

Structural Adhesive Joints (Adhesion and Adhesives: Fundamental and Applied Aspects)

Adhesive Joints: Formation, Characteristics, and Testing

Polyimides: Fundamentals and Applications (Plastics Engineering)