Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. 
<ul>
<li>Models and simulates numerous processes in manufacturing, reliability and testing for the first time</li> <li>Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing</li> <li>Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products</li> <li>Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects</li> <li>Appendix and color images available for download from the book's companion website</li> </ul>
Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging

Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing

Engineering & Transportation

Liu, Yong

Liu, Shen

Engineering

wiley

Since the first light-emitting diode (LED) was invented by Holonyak and Bevacqua in 1962, LEDs have made remarkable progress in the past few decades with the rapid development of epitaxy growth, chip design and manufacture, packaging structure, processes, and packaging materials. LEDs have superior characteristics such as high efficiency, small size, long life, low power consumption, and high reliability. The market for white LED is growing rapidly in various applications. It has been widely accepted that white LEDs will be the fourth illumination source to substitute the incandescent, fluorescent, and high-pressure sodium lamps. With the development of LED chip and packaging technologies, the efficiency of high power white LED will broaden the application markets of LEDs while changing the lighting concepts of our lives. 
In LED Packaging for Lighting Applications, Professors Liu and Luo cover the full spectrum of design, manufacturing, and testing. Many concepts are proposed for the first time, and readers will benefit from the concurrent engineering and co-design approaches to advanced engineering design of LED products. <ul>
<li>One of the only books to cover LEDs from package design to manufacturing to testing</li> <li>Focuses on the design of LED packaging and its applications such as road lights</li> <li>Includes design methods and experiences necessary for LED engineers, especially optical and thermal design</li> <li>Introduces novel LED packaging structures and manufacturing processes, such as ASLP</li> <li>Covers reliability considerations, the most challenging problem for the LED industry</li> <li>Provides measurement and testing standards, which are critical for LED development, for both LED and LED fixtures</li> <li>Codes and demonstrations available from the book’s Companion Website</li> </ul>
This book is ideal for practicing engineers working in design or packaging at LED companies and graduate students preparing for work in industry. This book also provides a helpful introduction for advanced undergraduates, graduates, researchers, lighting designers, and product managers interested in the fundamentals of LED design and production. Color version of selected figures can be found at www.wiley.com/go/liu/led

LED Packaging for Lighting Applications: Design, Manufacturing, and Testing

Luo, Xiaobing

A practical introduction to state-of-the-art freeform optics design for LED packages and applications By affording designers the freedom to create complex, aspherical optical surfaces with minimal or no aberrations, freeform design transcends the constraints imposed by hundreds of years of optics design and fabrication. Combining unprecedented design freedom with precise light irradiation control, freeform optics design is also revolutionizing the design and manufacture of high quality LED lighting. The first and only book of its kind, Freeform Optics for LED Packages and Applications helps put readers at the forefront of the freeform optics revolution. Designed to function as both an authoritative review of the current state of the industry and a practical introduction to advanced optical design for LED lighting, this book makes learning and mastering freeform optics skills simpler and easier than ever before with: <ul>
<li>Real-world examples and case studies systematically describing an array of algorithms and designs―from new freeform algorithms to design methods to advanced optical designs</li> <li>Coding for all freeform optics algorithms covered―makes it easier and more convenient to start developing points of freeform optics and construct lenses or reflectors, right away</li> <li>Case studies of a range of products, including designs for a freeform optics LED bulb, an LED spotlight, LED street lights, an LED BLU, and many more </li> </ul>
Freeform Optics for LED Packages and Applications is must-reading for optical design engineers and LED researchers, as well as advanced-level students with an interest in LED lighting. It is also an indispensable working resource design practitioners within the LED lighting industry.

Freeform Optics for LED Packages and Applications

Science & Math

Wu, Dan

Wang, Kai

Physics

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