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Lee, Yung-Cheng

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Manufacturing aspects in electronic packaging: Presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Anaheim, California, November 8-13, 1992 (EEP) image

Manufacturing aspects in electronic packaging: Presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Anaheim, California, November 8-13, 1992 (EEP)

Author(s): Lee, Yung-Cheng
ISBN-13: 9780791811122
Publisher: The Society]
Released: Jan 01, 1992
Format: Hardcover, 211 pages
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