Proceedings of the First International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications (Electronics and Dielectric S)

(2)
Proceedings of the First International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications (Electronics and Dielectric S) image
ISBN-10:

1566770084

ISBN-13:

9781566770088

Author(s): Gosele, Ulrich
Format: Paperback, 0 pages

Description:

Book details unavailable.

Best prices to buy, sell, or rent ISBN 9781566770088




Frequently Asked Questions about Proceedings of the First International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications (Electronics and Dielectric S)

You can buy the Proceedings of the First International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications (Electronics and Dielectric S) book at one of 20+ online bookstores with BookScouter, the website that helps find the best deal across the web. Currently, the best offer comes from and is $ for the .

The price for the book starts from $133.49 on Amazon and is available from 1 sellers at the moment.

If you’re interested in selling back the Proceedings of the First International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications (Electronics and Dielectric S) book, you can always look up BookScouter for the best deal. BookScouter checks 30+ buyback vendors with a single search and gives you actual information on buyback pricing instantly.

As for the Proceedings of the First International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications (Electronics and Dielectric S) book, the best buyback offer comes from and is $ for the book in good condition.

Not enough insights yet.

Not enough insights yet.