Reliability of RoHS-Compliant 2D and 3D IC Interconnects (Electronic Engineering)

(9)
Reliability of RoHS-Compliant 2D and 3D IC Interconnects (Electronic Engineering) image
ISBN-10:

0071753796

ISBN-13:

9780071753791

Author(s): Lau, John H.
Edition: 1
Released: Dec 22, 2010
Publisher: McGraw=Hill
Format: Hardcover, 640 pages

Description:

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.


Proven 2D and 3D IC lead-free interconnect reliability techniques

Reliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects in RoHS-compliant projects using the detailed information in this practical resource.

Covers reliability of:

  • 2D and 3D IC lead-free interconnects
  • CCGA, PBGA, WLP, PQFP, flip-chip, lead-free SAC solder joints
  • Lead-free (SACX) solder joints
  • Low-temperature lead-free (SnBiAg) solder joints
  • Solder joints with voids, high strain rate, and high ramp rate
  • VCSEL and LED lead-free interconnects
  • 3D LED and 3D MEMS with TSVs
  • Chip-to-wafer (C2W) bonding and lead-free interconnects
  • Wafer-to-wafer (W2W) bonding and lead-free interconnects
  • 3D IC chip stacking with low-temperature bonding
  • TSV interposers and lead-free interconnects
  • Electromigration of lead-free microbumps for 3D IC integration

Best prices to buy, sell, or rent ISBN 9780071753791




Frequently Asked Questions about Reliability of RoHS-Compliant 2D and 3D IC Interconnects (Electronic Engineering)

You can buy the Reliability of RoHS-Compliant 2D and 3D IC Interconnects (Electronic Engineering) book at one of 20+ online bookstores with BookScouter, the website that helps find the best deal across the web. Currently, the best offer comes from and is $ for the .

The price for the book starts from $23.99 on Amazon and is available from 9 sellers at the moment.

If you’re interested in selling back the Reliability of RoHS-Compliant 2D and 3D IC Interconnects (Electronic Engineering) book, you can always look up BookScouter for the best deal. BookScouter checks 30+ buyback vendors with a single search and gives you actual information on buyback pricing instantly.

As for the Reliability of RoHS-Compliant 2D and 3D IC Interconnects (Electronic Engineering) book, the best buyback offer comes from and is $ for the book in good condition.

Not enough insights yet.

Not enough insights yet.