Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies
Description:
One-stop, cutting-edge guide to flip chip technologies. Now you can turn to a single, all-encompassing reference for a practical understanding of the fast-developing field that's taking the electronics industry by storm. Low-Cost Flip Chip Technologies, by John H. Lau, brings you up to speed on the economic, design, materials, process,equipment, quality, manufacturing, and reliability issues related to low cost flip chip technologies. This eye-opening overview tells you what you need to know about applying flip chip technologies to direct chip attach(DCA), flip chip on board (FCOB), wafer level chip scale package (WLCSP), and plastic ball grid array (PBGA) package assemblies. You'll discover flip chip problem-solving methods, and learn how to choose a cost-effective design and reliable, high-yield manufacturing process for your interconnect systems as you explore...
*IC trends and packaging technology updates
*Over 12 different wafer-bumping methods...more than 100 lead-free solder alloys
*Sequential build up PCB with microvias and via-in-pad
*How to select underfill materials
*And much, much more!
Best prices to buy, sell, or rent ISBN 9780071351416
Frequently Asked Questions about Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies
The price for the book starts from $34.71 on Amazon and is available from 4 sellers at the moment.
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The Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies book is in very low demand now as the rank for the book is 5,797,696 at the moment. A rank of 1,000,000 means the last copy sold approximately a month ago.
The highest price to sell back the Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies book within the last three months was on October 15 and it was $1.44.