<p>Physical Design for Multichip Modules collects together a large body of important research work that has been conducted in recent years in the area of Multichip Module (MCM) design. The material consists of a survey of published results as well as original work by the authors. All major aspects of MCM physical design are discussed, including interconnect analysis and modeling, system partitioning and placement, and multilayer routing. For readers unfamiliar with MCMs, this book presents an overview of the different MCM technologies available today. An in-depth discussion of various recent approaches to interconnect analysis are also presented. Remaining chapters discuss the problems of partitioning, placement, and multilayer routing, with an emphasis on timing performance. For the first time, data from a wide range of sources is integrated to present a clear picture of a new, challenging and very important research area. For students and researchers looking for interesting research topics, open problems and suggestions for further research are clearly stated. <br> Points of interest include :</p>
<ul>
<li> Clear overview of MCM technology and its relationship to physical design; </li> <li> Emphasis on performance-driven design, with a chapter devoted to recent techniques for rapid performance analysis and modeling of MCM interconnects; </li> <li> Different approaches to multilayer MCM routing collected together and compared for the first time; </li> <li> Explanation of algorithms is not overly mathematical, yet is detailed enough to give readers a clear understanding of the approach; </li> <li> Quantitative data provided wherever possible for comparison of different approaches; </li> <li> A comprehensive list of references to recent literature on MCMs provided.</li> </ul>

Physical Design for Multichip Modules (The Springer International Series in Engineering and Computer Science, 267)

Arts & Photography

Sung-Mo (Steve) Kang

Sriram, Mysore

Graphic Design

Springer

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Books by Sriram, Mysore

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Physical Design for Multichip Modules (The Springer International Series in Engineering and Computer Science, 267)