<p>This new volume by interconnection expert on solder joints, Johns H. Lau, deals with BGA, CSP, Flip Chips, and other new technologies that underlie the electronics industry's need for smaller, faster products. Naturally, as ever-smaller products are created, the reliability of the solder joints that bind them becomes increasingly crucial. Balancing concepts and practical applications, the authors explain the fundamentals of solder joint reliability and present creative, robust packaging techniques for cost-effective interconnection.</p>

Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies

Engineering & Transportation

Lau, John H.

Pao, Yi-Hsin

Engineering

McGraw-Hill Professional

See the best price to sell, buy, or rent books by Pao, Yi-Hsin. BookScouter helps to compare book prices from 25+ online bookstores and 30+ buyback vendors with a single search.

Books by Pao, Yi-Hsin

See the best price to sell, buy, or rent books by Pao, Yi-Hsin. BookScouter helps to compare book prices from 25+ online bookstores and 30+ buyback vendors with a single search.

Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies